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  z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) specification SPW88F0E customer customer customer customer approval approval drawn ssc ssc ssc ssc
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) SPW88F0E 1. description 2. absolute maximum ratings 3. electro- optical characteristics 4. characteristic diagram 5. cie chromaticity diagram 6. binning table 7. outline dimension 8. reel structure 9. packing 10. soldering 11. precaution for use 12. handling of silicon resin leds
z-power led x10490 technical data sheet ???? : ssc- qp- 7- 07- 24 (rev.00) rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com SPW88F0E features applications it has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame (ag plating). the die is attached within the reflector cavity and the cavity is encapsulated by silicone the high reliability feature is crucial to automoti ve front, interior lamp and general lights 1. description SPW88F0E SPW88F0E SPW88F0E SPW88F0E ? industry standard smt package ? low thermal resistance ? lead free product ? rohs compliant ? lighting
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 2. absolute maximum ratings 125 t j junction temperature -40 ~+100 t stg storage temperature k/w 13 r th-js thermal resistance -40 ~+80 t opr operating temperature ma 100 (min.) 300 (typ.) 400 (max.) i f forward current (ta = 25) w 1 p d power dissipation [1] unit value symbol parameter [1]. care is to be taken that power dissipation doe s not exceed the absolute maximum rating of the pro duct.. 3. electro-optical characteristics [1]. the luminous flux was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the led package. luminous fl ux measurement allowance is 10% [2]. correlated color temperature is derived from t he cie 1931 chromaticity diagram. color coordinate : 0.005, cct 5% tolerance [3]. 2 ? is the off-axis where the luminous intensity is 1/2 of the peak intensity. 6000 k cct correlated color temperature [ 2] - 80 r a cri deg. 120 2 ? viewing angle [ 3] lm 100 v luminance flux [ 1] v 3.75 3.4 - v f forward voltage unit max typ min symbo l parameter
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 25 50 75 100 125 150 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 4. characteristic diagram junction temperature [ t j ] r e l a t i v e f o r w a r d v o l t a g e wavelength vs. relative spectral power distributio n ( i f =300ma)
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 4. characteristic diagram forward current vs. forward voltage relative luminous intensity vs forward current ( t a =25 o c ) forward voltage v f (v) f o r w a r d c u r r e n t i f [ m a ] r e l a t i v e l u m i n o u s f l u x forward current i f [ma] ( t a =25 o c ) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 100 200 300 400 0 100 200 300 400 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 20 40 60 80 100 120 140 0.0 0.2 0.4 0.6 0.8 1.0 4. characteristic diagram junction temperature [ t j ] r e l a t i v e f o r w a r d v o l t a g e relative forward voltage vs. junction temperature r e l a t i v e l u m i n o u s i n t e n s i t y relative luminous intensity vs. junction temperatur e ( i f =300ma) ( i f =300ma) junction temperature [ t j ] 25 50 75 100 125 150 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 4. characteristic diagram junction temperature [ t j ] r e l a t i v e d o m i n a n t w a v e l e n g t h relative dominant wavelength vs. junction temperatu re ( i f =300ma) 25 50 75 100 125 150 0 2 4 6 8 10 12 14
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 0 20 40 60 80 100 120 140 0 100 200 300 400 500 4. characteristic diagram -90 -60 -30 90 60 30 0 radiation diagram ambient temperature vs. forward current temperature [ t ] f o r w a r d c u r r e n t i f [ m a ] 1.rja = 35 1.rja = 35 1.rja = 35 1.rja = 35 / w / w/ w / w 2. 2.2. 2.rja = 45 rja = 45 rja = 45 rja = 45 / w / w/ w / w 3. 3.3. 3.rja = 55 rja = 55 rja = 55 rja = 55 / w / w/ w / w t tt t t tt t t tt t
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 6. cie chromaticity diagram [ta = 25 if = 300ma] c ie x c ie y c ie x c ie y cie x cie y c ie x c ie y c ie x c ie y 0.3 028 0.3 304 0.3115 0.3393 0 .304 1 0.32 4 0.31 26 0.33 24 0.3 0 55 0.3 177 0.3 041 0.3 24 0.3126 0.3324 0 .305 5 0 .317 7 0.31 36 0.32 56 0.3 0 68 0.3 113 0.3 126 0.3 324 0.321 0.3408 0 .313 6 0 .325 6 0.32 16 0.33 34 0.3 1 46 0.3 187 0.3 115 0.3 393 0.3205 0.3481 0 .312 6 0 .332 4 0.32 1 0.34 08 0.3 1 36 0.3 256 c ie x c ie y c ie x c ie y cie x cie y c ie x c ie y c ie x c ie y 0.3 136 0.3 256 0.3068 0.3113 0 .314 6 0 .318 7 0.30 82 0.30 46 0.3 155 0.312 0.3 146 0.3 187 0.3082 0.3046 0 .315 5 0.31 2 0.30 96 0.2 98 0.3 16 4 0.3 046 0.3 221 0.3 261 0.3155 0 .312 0 .322 5 0.31 9 0.31 64 0.30 46 0.3 23 0.311 0.3 216 0.3 334 0.3146 0.3187 0 .322 1 0 .326 1 0.31 55 0.3 12 0.3 2 25 0.319 c ie x c ie y c ie x c ie y cie x cie y c ie x c ie y c ie x c ie y 0.3 207 0.3 462 0.3292 0.3539 0 .321 2 0 .338 9 0.32 93 0.34 61 0.3 217 0.3 316 0.3 212 0.3 389 0.3293 0.3461 0 .321 7 0 .331 6 0.32 93 0.33 84 0.3 222 0.3 243 0.3 293 0.3 461 0.3373 0.3534 0 .329 3 0 .338 4 0.33 69 0.34 51 0.3 294 0.3 306 0.3 292 0.3 539 0.3376 0.3616 0 .329 3 0 .346 1 0.33 73 0.35 34 0.3 293 0.3 384 c ie x c ie y c ie x c ie y cie x cie y c ie x c ie y c ie x c ie y 0.3 293 0.3 384 0.3222 0.3243 0 .329 4 0 .330 6 0.3 2 0.35 72 0.3 29 0.3 656 0.3 294 0.3 306 0.3226 0.3178 0 .329 5 0 .323 4 0.32 07 0.34 62 0.3 292 0.3 539 0.3 366 0.3 369 0.3295 0.3234 0 .336 4 0 .328 8 0.32 92 0.35 39 0.3 376 0.3 616 0.3 369 0.3 451 0.3294 0.3306 0 .336 6 0 .336 9 0.32 9 0.36 56 0.3 3 81 0.374 c ie x c ie y c ie x c ie y cie x cie y c ie x c ie y c ie x c ie y 0.3 376 0.3 616 0.3463 0.3687 0 .337 3 0 .353 4 0.34 56 0.36 01 0.3 369 0.3 451 0.3 373 0.3 534 0.3456 0.3601 0 .336 9 0 .345 1 0.34 48 0.35 14 0.3 366 0.3 369 0.3 456 0.3 601 0.3539 0.3669 0 .344 8 0 .351 4 0.35 26 0.35 78 0.3 44 0.3 428 0.3 463 0.3 687 0.3552 0 .376 0 .345 6 0 .360 1 0.35 39 0.36 69 0.3 4 48 0.3 514 c ie x c ie y c ie x c ie y cie x cie y c ie x c ie y c ie x c ie y 0.3 448 0.3 514 0.3366 0.3369 0 .344 0 .342 8 0.33 81 0.3 74 0.3 47 0.381 0.3 44 0.3 428 0.3365 0.3288 0 .343 3 0 .334 5 0.34 7 0.3 81 0.3 572 0.3 891 0.3 514 0.3 487 0.3433 0.3345 0.35 0.34 0.34 63 0.36 87 0.3 552 0 .376 0.3 526 0.3 578 0.344 0.3428 0 .351 4 0 .348 7 0.33 76 0.36 16 0.3 4 63 0.3 687 c 4 c 5 c6 c7 c8 c 9 c 0 c1 c2 c3 b 4 b 5 b6 b7 b8 b 9 b 0 b1 b2 b3 a4 a5 a6 a7 a8 a9 a0 a1 a2 a3
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 7. binning table 100 91 u1 118.5 109 u3 109 100 u2 max. min. bin code luminous flux (lm) @ i f = 300ma bin code forward voltage (v) @ i f = 300ma luminous flux (lm) @ i f = 300ma color chromaticity coordinate @ i f = 300ma available ranks 3.75 3.50 j 3.50 3.25 i 3.25 3.0 h max. min. bin code forward voltage (v) @ i f = 300ma max. min. bin code ref. 10 pages color chromaticity coordinate @ i f = 300ma
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 8.outline dimension ( tolerance: 0.2, unit: mm ) < package outline > < solder pattern >
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 180 2 13 22 60 15.4 1.0 13 0.3 9. reel structure ( tolerance: 0.2, unit: mm ) (1) quantity : 1,500pcs/reel (2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm (3) adhesion strength of cover tape : adhesion stre ngth to be 0.1-0.7n when the cover tape is turned o ff from the carrier tape at the angle of 10o to the carrier tape (4) package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package 4.80 0.1 (4.75) 12.0 0.2 5.30 0.1 1.30 0.1 1.75 0.1 5.5 0.05 0.25 0.05 4 0.1 2 0.05 8.0 0.1 1 . 5 + 0 . 1 , - 0 1 . 5 m i n package marking
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 10. packing
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 11. soldering 10 sec. max. soldering time condition 240 max. peak-temperature 120 sec. max. pre-heat time 120~150 pre-heat lead solder 10 sec. max. soldering time condition 260 max. peak-temperature 120 sec. max. pre-heat time 150~200 pre-heat lead free solder lead solder 2.5~5 c / sec. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. (1) lead solder (2) lead-free solder (3) hand soldering conditions do not exceed 4 seconds at maximum 315oc under sold ering iron. (4) the encapsulated material of the leds is silicon e. precautions should be taken to avoid the strong pre ssure on the encapsulated part. so when using the chip mounter, the picking up nozz le that does not affect the silicone resign should be used. note : in case that the soldered products are reuse d in soldering process, we dont guarantee the prod ucts. lead-free solder 1~5 c / sec. o o o o 1~5 c / sec. pre-heating 150~200 c 120sec. max. 60sec. max. above 220 c o 260 c max. 10 sec. max.
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 12. precaution for use (1) storage in order to avoid the absorption of moisture, it is recommended to store in a dry box with a desiccant. otherwise, to store them in the f ollowing environment is recommended. temperature : 5oc ~30oc humidity : maximum 70%rh (2) attention after open. led is correspond to smd, when led be soldered dip, interfacial separation may affect the light transmission efficiency, causing t he light intensity to drop. attention in followed; keeping of a fraction temperature : 5 ~ 40oc humidity : less than 10% (3) in the case of more than 4 week passed after op ening or change color of indicator on desiccant, components shall be dried 1 0-12hr. at 60 5oc. (4) any mechanical force or any excess vibration sh all not be accepted to apply during cooling process to normal temperature after soldering. (5) quick cooling shall be avoided. (6) components shall not be mounted on warped direc tion of pcb. (7) anti radioactive ray design is not considered f or the products. (8) this device should not be used in any type of f luid such as water, oil, organic solvent etc. when washing is required, ipa should b e used. (9) when the leds are illuminating, operating curren t should be decided after considering the ambient maximum temperature. (10) the leds must be soldered within seven days aft er opening the moisture-proof packing. (11) repack unused products with anti-moisture pack ing, fold to close any opening and then store in a dry place. (12) the appearance and specifications of the produ ct may be modified for improvement without notice.
z-power led x10490 z-power led x10490 technical data sheet rev. 0.00 rev. 0.00 march 2011. march 2011. www.acrich.com www.acrich.com ???? : ssc- qp- 7- 07- 24 (rev.00) 13. handling of silicone resin leds (1) during processing, mechanical stress on the sur face should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. (2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surfac e can also become scratched. (3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, ex cept that mechanical pressure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. (4) silicone differs from materials conventionally used for the manufacturing of leds. these conditions must be considered during the hand ling of such devices. compared to standard encapsulants, silicone is generally softer , and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level o f dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be ap plied to the surface after the soldering of components. (5) ssc suggests using isopropyl alcohol for cleani ng. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led.


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